iPhone 7 Mobo Leak Reveals More Inside Details

August 10, 2016, By Sanjeev Ramachandran

iPhone 7 is not expected to be big in terms of comparison with its predecessor. But that doesn’t rule out the addition of some good features from the device.

A new leak of the iPhone motherboard has now given us a deeper look into what the upcoming Apple smartphone will be packing inside, and it doesn’t appear bleak by what it looks. What can be seen on the motherboard is the array of hardware including SIM connector, 2 GB of RAM and its next-generation A10 processor.

The SIM slot connector is stacked below the processor slot, and the M10 motion processors appears to be manufactured by TSMC. The motherboard is believed to pack 2GB RAM, while its also expected that the bigger 5.5-inch iPhone 7 Plus/Pro will ship with 3GB RAM, adjusted for the dual-lens rear camera.


Interestingly, the faster A10 processor can also be slotted, which seems to be the catchy part in terms of hardware with the iPhone 7 devices. The new-gen processor will be making its debut on the upcoming Apple smartphone.

Apart from the hardware leak, there have also been other rumours that point towards another good addition in the iPhone 7 device. A report from Mark Gurman now suggest that Apple will be replacing the physical home button in Apple iPhone 7 devices with a pressure-sensitive button that will work similar to the 3D Touch.

It will also come with haptic feedback, and will continue to serve as the fingerprint sensor holder in iPhone devices according to the report.

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