Nintendo 3DS Design and Hardware Specs Unveiled

June 18, 2010, By Sanjeev Ramachandran

Nintendo has displayed the new design and a range of hardware specifications for its 3DS gaming console on its E3 2010 website. However, the company has not mentioned important hardware details regarding the console such as the capacity of the RAM and CPU.

The 3DS will weigh around 8 ounces and will have dimensions of 5.3×2.9×0.8 inches (wxdxh). The viewing screen of the device will be a 3.53-inch widescreen LCD display with a resolution of 800×240 pixels and 400 pixels have been set for each eye to allow for 3D viewing without special glasses. A slider has been added at the top of the 3DS for users to control the extent of the 3D effects and even change it to 2D mode.

The device will also have a separate LCD touch screen of 3.02 inches with a resolution of 320×240 pixels. It also has three 0.3 megapixel cameras, of which two are placed on the outer side of the device and one is placed on the inner side. All three of them have a resolution of 640×380 pixels.

Wireless connectivity for the 3DS includes a WiFi connection. The device can also connect to other 3DS systems wirelessly and can receive and exchange data with the Internet and other 3DS consoles in sleep mode.

The 3DS will support game cards and SD cards of up to 2 GB at the time of launch. It will also use new 3DS cards in addition to the DS cards. Gaming controls are similar to the ones in the Nintendo DS except for the new ‘thumb stick’ that is present in the 3DS.

The design of the 3DS that has been showcased on the Nintendo E3 site has been categorized as ‘To Be Announced’ (TBA), which means that the final design could be different from the one displayed. Other specifications such as the battery details and the software that will come pre-installed in the 3DS, have also been mentioned as TBA.

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